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| Application | High-Soldering Temperature |
| Diameter | 0.3 mm |
| Features | Higher Strength Due To Nickel Compared To Other Silver-Free Alloys, Reduced Fe Leaching To Increase Tip Life Time And Reduce Tip Consumption By Upto 70%, Reduced Splash Of Flux And No-Clean Flux, Solder Joint Shines (Perfect Optics), Very Fast Wetting Even On Difficult Surfaces, As Dirty And Oxidized Materials |
| Flux Classification | ROM1 |
| Flux Requirement | Contains Flux Core |
| Flux Type | No Clean |
| For Joining | Metal |
| Form | Flux Cored Wire |
| Material Composition | 99.3% Tin, 0.6% Copper, 0.05% Nickel |
| Maximum Soldering Temperature | 444°F |
| Mfr. Series | SCN M1 |
| Min. Temp. | 442°F |
| Weight | 100g |
| Ship weight (kg) | 0.1395 |
| Ship height (cm) | 2.54 |
| Ship length (cm) | 2.54 |
| Ship width (cm) | 2.54 |
| Country of Origin | JP |
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